Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz

Leigh E. Milner; Shyam G. Mehta; Leonard T. Hall; Simon J. Mahon; Sudipta Chakraborty; Michael C. Heimlich

doi:10.23919/EuMC50147.2022.9784265

Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz

Leigh E. Milner, Shyam G. Mehta, Leonard T. Hall, Simon J. Mahon^*, Sudipta Chakraborty, Michael C. Heimlich

^*Corresponding author for this work

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

3 Citations (Scopus)

Abstract

A hot-via transition from a monolithic microwave integrated circuit (MMIC) to a printed circuit board (PCB) has been developed with a measured back-to-back insertion loss less than 0.88 dB and return loss higher than 20 dB from dc to 110 GHz. Two techniques are proposed to extend the maximum operating frequency of the microstrip to grounded coplanar waveguide (GCPW) transition. An oversized microstrip line is used on the MMIC to increase capacitance, and a critical return path via in the PCB is positioned near the edge of the hot-via gap to lower inductance. Both techniques improve the maximum operating frequency to 110 GHz for a transition with return loss better than 20 dB and insertion loss of 0.39 dB. To the authors' best knowledge, this MMIC packaging technique demonstrates the highest bandwidth achieved for a dc connected hot-via transition with less than 1 dB back-to-back insertion loss.

Original language	English
Title of host publication	Proceedings of the 2021 51st European Microwave Conference (EuMC)
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	14-17
Number of pages	4
ISBN (Electronic)	9782874870637
ISBN (Print)	9781665447218
DOIs	https://doi.org/10.23919/EuMC50147.2022.9784265
Publication status	Published - 2021
Event	51st European Microwave Conference, EuMC 2021 - London, United Kingdom Duration: 4 Apr 2022 → 6 Apr 2022

Conference

Conference	51st European Microwave Conference, EuMC 2021
Country/Territory	United Kingdom
City	London
Period	4/04/22 → 6/04/22

Keywords

hot-via
monolithic microwave integrated circuit (MMIC)
integrated circuit packaging
interconnect

Access to Document

10.23919/EuMC50147.2022.9784265

Cite this

Milner, L. E., Mehta, S. G., Hall, L. T., Mahon, S. J., Chakraborty, S., & Heimlich, M. C. (2021). Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz. In Proceedings of the 2021 51st European Microwave Conference (EuMC) (pp. 14-17). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.23919/EuMC50147.2022.9784265

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title = "Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz",

abstract = "A hot-via transition from a monolithic microwave integrated circuit (MMIC) to a printed circuit board (PCB) has been developed with a measured back-to-back insertion loss less than 0.88 dB and return loss higher than 20 dB from dc to 110 GHz. Two techniques are proposed to extend the maximum operating frequency of the microstrip to grounded coplanar waveguide (GCPW) transition. An oversized microstrip line is used on the MMIC to increase capacitance, and a critical return path via in the PCB is positioned near the edge of the hot-via gap to lower inductance. Both techniques improve the maximum operating frequency to 110 GHz for a transition with return loss better than 20 dB and insertion loss of 0.39 dB. To the authors' best knowledge, this MMIC packaging technique demonstrates the highest bandwidth achieved for a dc connected hot-via transition with less than 1 dB back-to-back insertion loss. ",

keywords = "hot-via, monolithic microwave integrated circuit (MMIC), integrated circuit packaging, interconnect",

author = "Milner, {Leigh E.} and Mehta, {Shyam G.} and Hall, {Leonard T.} and Mahon, {Simon J.} and Sudipta Chakraborty and Heimlich, {Michael C.}",

year = "2021",

doi = "10.23919/EuMC50147.2022.9784265",

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booktitle = "Proceedings of the 2021 51st European Microwave Conference (EuMC)",

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Milner, LE, Mehta, SG, Hall, LT, Mahon, SJ , Chakraborty, S & Heimlich, MC 2021, Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz. in Proceedings of the 2021 51st European Microwave Conference (EuMC). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, pp. 14-17, 51st European Microwave Conference, EuMC 2021, London, United Kingdom, 4/04/22. https://doi.org/10.23919/EuMC50147.2022.9784265

Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz. / Milner, Leigh E.; Mehta, Shyam G.; Hall, Leonard T. et al.
Proceedings of the 2021 51st European Microwave Conference (EuMC). Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), 2021. p. 14-17.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

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AU - Milner, Leigh E.

AU - Mehta, Shyam G.

AU - Hall, Leonard T.

AU - Mahon, Simon J.

AU - Chakraborty, Sudipta

AU - Heimlich, Michael C.

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AB - A hot-via transition from a monolithic microwave integrated circuit (MMIC) to a printed circuit board (PCB) has been developed with a measured back-to-back insertion loss less than 0.88 dB and return loss higher than 20 dB from dc to 110 GHz. Two techniques are proposed to extend the maximum operating frequency of the microstrip to grounded coplanar waveguide (GCPW) transition. An oversized microstrip line is used on the MMIC to increase capacitance, and a critical return path via in the PCB is positioned near the edge of the hot-via gap to lower inductance. Both techniques improve the maximum operating frequency to 110 GHz for a transition with return loss better than 20 dB and insertion loss of 0.39 dB. To the authors' best knowledge, this MMIC packaging technique demonstrates the highest bandwidth achieved for a dc connected hot-via transition with less than 1 dB back-to-back insertion loss.

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ER -

Optimised hot-via transition with 20 dB return loss for MMIC packaging from dc to 110 GHz

Abstract

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Keywords

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