Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

Syed Hassan Abbas Jaffery; Mohd Faizul Mohd Sabri; Shaifulazuar Rozali; Syed Waqar Hasan; Mohammad Hossein Mahdavifard; Dhafer Abdul-ameer Shnawah AL-Zubiady; Balaji Rao Ravuri

doi:10.1016/j.microrel.2022.114802

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

Syed Hassan Abbas Jaffery, Mohd Faizul Mohd Sabri^*, Shaifulazuar Rozali, Syed Waqar Hasan, Mohammad Hossein Mahdavifard, Dhafer Abdul-ameer Shnawah AL-Zubiady, Balaji Rao Ravuri

^*Corresponding author for this work

School of Engineering

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

Abstract

In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 °C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO₂ oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO₂. Addition of Bi results in the formation of Bi₂O₃. The Pilling-Bedworth ratio of SnO, SnO₂ and Bi₂O₃ oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy.

Original language	English
Article number	114802
Pages (from-to)	1-11
Number of pages	11
Journal	Microelectronics Reliability
Volume	139
DOIs	https://doi.org/10.1016/j.microrel.2022.114802
Publication status	Published - Dec 2022

Keywords

Sn-0.7Cu alloy
Fe and Bi alloying
Oxidation behaviour
X-ray photoelectron spectroscopy (XPS)
Wetting behaviour

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10.1016/j.microrel.2022.114802

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title = "Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi",

abstract = "In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 °C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO2 oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO2. Addition of Bi results in the formation of Bi2O3. The Pilling-Bedworth ratio of SnO, SnO2 and Bi2O3 oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy.",

keywords = "Sn-0.7Cu alloy, Fe and Bi alloying, Oxidation behaviour, X-ray photoelectron spectroscopy (XPS), Wetting behaviour",

author = "Jaffery, \{Syed Hassan Abbas\} and Sabri, \{Mohd Faizul Mohd\} and Shaifulazuar Rozali and Hasan, \{Syed Waqar\} and Mahdavifard, \{Mohammad Hossein\} and AL-Zubiady, \{Dhafer Abdul-ameer Shnawah\} and Ravuri, \{Balaji Rao\}",

year = "2022",

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doi = "10.1016/j.microrel.2022.114802",

language = "English",

volume = "139",

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journal = "Microelectronics Reliability",

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T1 - Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

AU - Jaffery, Syed Hassan Abbas

AU - Sabri, Mohd Faizul Mohd

AU - Rozali, Shaifulazuar

AU - Hasan, Syed Waqar

AU - Mahdavifard, Mohammad Hossein

AU - AL-Zubiady, Dhafer Abdul-ameer Shnawah

AU - Ravuri, Balaji Rao

PY - 2022/12

Y1 - 2022/12

N2 - In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 °C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO2 oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO2. Addition of Bi results in the formation of Bi2O3. The Pilling-Bedworth ratio of SnO, SnO2 and Bi2O3 oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy.

AB - In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 °C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO2 oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO2. Addition of Bi results in the formation of Bi2O3. The Pilling-Bedworth ratio of SnO, SnO2 and Bi2O3 oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy.

KW - Sn-0.7Cu alloy

KW - Fe and Bi alloying

KW - Oxidation behaviour

KW - X-ray photoelectron spectroscopy (XPS)

KW - Wetting behaviour

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U2 - 10.1016/j.microrel.2022.114802

DO - 10.1016/j.microrel.2022.114802

M3 - Article

AN - SCOPUS:85139292718

SN - 0026-2714

VL - 139

SP - 1

EP - 11

JO - Microelectronics Reliability

JF - Microelectronics Reliability

M1 - 114802

ER -

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

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Keywords

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