Abstract
Numerical investigation of the effect on the dispersion diagram of a different number of off-axis positioned grounding vias for an elliptic patch in periodic arrangement is presented. Various aspect ratios for the mushroom-like structure in microstrip technology have been considered. The position of the vias has been moved according to the variation of the geometry, guaranteeing an easy scalability. It was found that the degenerate geometry of circular shape guarantees the maximum width of the band-gap for almost all analyzed configurations. The band-gap decreases with the increase of the number of vias, which in turn corresponds to a transition from an open resonator to a closed cavity. A variation of more than 10% in the width of the bandgap has been observed.
| Original language | English |
|---|---|
| Title of host publication | EuCAP 2010 - The 4th European Conference on Antennas and Propagation |
| Place of Publication | Piscataway, NJ |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Pages | 1-3 |
| Number of pages | 3 |
| ISBN (Print) | 9788476534724 |
| Publication status | Published - 2010 |
| Event | 4th European Conference on Antennas and Propagation, EuCAP 2010 - Barcelona, Spain Duration: 12 Apr 2010 → 16 Apr 2010 |
Other
| Other | 4th European Conference on Antennas and Propagation, EuCAP 2010 |
|---|---|
| Country/Territory | Spain |
| City | Barcelona |
| Period | 12/04/10 → 16/04/10 |
Bibliographical note
Copyright 2010 IEEE. Reprinted from Proceedings of the Fourth European Conference on Antennas and Propagation : CCIB, Barcelona, Spain, 12-16 April 2010. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to [email protected]. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.Fingerprint
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