Abstract
The escalating applications of miniaturized sensors have led the microelectronics industry to stay abreast with the precise micro-fabrication technologies. The following article describes a new technique for the fabrication of miniaturized interdigitated capacitive sensors that own highly sensitive and real-time detections capabilities. In standard lithographic procedure, the sensors are fabricated applying different photoresist materials that give rise to the variable characteristic profile of the fabricated product. Single crystal p-doped Silicon wafer was used as a substrate material due to its advantageous properties over Germanium. Heidelberg system was used for the maskless lithographic patterning of the new interdigital sensors on a silicon substrate. The process was carried out in a clean room in the absence of ultraviolet light at a fixed temperature. The fabricated sensors were used for inflammable gas sensing application. Electrochemical Impedance Spectroscopy was applied to read the resistive and capacitive impedance measured by the sensor. The results proclaimed that the fabricated sensors own better performance in LPG detection as compared to its commercial counterparts.
| Language | English |
|---|---|
| Title of host publication | ICST 2015 |
| Subtitle of host publication | proceedings of the 9th International Conference on Sensing Technology |
| Place of Publication | Piscataway, NJ |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Pages | 374-379 |
| Number of pages | 6 |
| ISBN (Electronic) | 9781479963140 |
| DOIs | |
| Publication status | Published - 2015 |
| Externally published | Yes |
| Event | 9th International Conference on Sensing Technology, ICST 2015 - Auckland, New Zealand Duration: 8 Dec 2015 → 11 Dec 2015 |
Other
| Other | 9th International Conference on Sensing Technology, ICST 2015 |
|---|---|
| Country | New Zealand |
| City | Auckland |
| Period | 8/12/15 → 11/12/15 |
Fingerprint
Keywords
- ablation
- Maskless Lithography
- photoresist
- silicon wafers
- sputtering
- wire bonding
Cite this
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Performance enhancement of electronic sensor through mask-less lithography. / Nag, Anindya; Zia, Asif I.; Mukhopadhyay, S. C.; Kosel, Jurgen.
ICST 2015: proceedings of the 9th International Conference on Sensing Technology. Piscataway, NJ : Institute of Electrical and Electronics Engineers (IEEE), 2015. p. 374-379.Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › Research › peer-review
TY - GEN
T1 - Performance enhancement of electronic sensor through mask-less lithography
AU - Nag, Anindya
AU - Zia, Asif I.
AU - Mukhopadhyay, S. C.
AU - Kosel, Jurgen
PY - 2015
Y1 - 2015
N2 - The escalating applications of miniaturized sensors have led the microelectronics industry to stay abreast with the precise micro-fabrication technologies. The following article describes a new technique for the fabrication of miniaturized interdigitated capacitive sensors that own highly sensitive and real-time detections capabilities. In standard lithographic procedure, the sensors are fabricated applying different photoresist materials that give rise to the variable characteristic profile of the fabricated product. Single crystal p-doped Silicon wafer was used as a substrate material due to its advantageous properties over Germanium. Heidelberg system was used for the maskless lithographic patterning of the new interdigital sensors on a silicon substrate. The process was carried out in a clean room in the absence of ultraviolet light at a fixed temperature. The fabricated sensors were used for inflammable gas sensing application. Electrochemical Impedance Spectroscopy was applied to read the resistive and capacitive impedance measured by the sensor. The results proclaimed that the fabricated sensors own better performance in LPG detection as compared to its commercial counterparts.
AB - The escalating applications of miniaturized sensors have led the microelectronics industry to stay abreast with the precise micro-fabrication technologies. The following article describes a new technique for the fabrication of miniaturized interdigitated capacitive sensors that own highly sensitive and real-time detections capabilities. In standard lithographic procedure, the sensors are fabricated applying different photoresist materials that give rise to the variable characteristic profile of the fabricated product. Single crystal p-doped Silicon wafer was used as a substrate material due to its advantageous properties over Germanium. Heidelberg system was used for the maskless lithographic patterning of the new interdigital sensors on a silicon substrate. The process was carried out in a clean room in the absence of ultraviolet light at a fixed temperature. The fabricated sensors were used for inflammable gas sensing application. Electrochemical Impedance Spectroscopy was applied to read the resistive and capacitive impedance measured by the sensor. The results proclaimed that the fabricated sensors own better performance in LPG detection as compared to its commercial counterparts.
KW - ablation
KW - Maskless Lithography
KW - photoresist
KW - silicon wafers
KW - sputtering
KW - wire bonding
UR - http://www.scopus.com/inward/record.url?scp=84964864147&partnerID=8YFLogxK
U2 - 10.1109/ICSensT.2015.7438426
DO - 10.1109/ICSensT.2015.7438426
M3 - Conference proceeding contribution
SP - 374
EP - 379
BT - ICST 2015
PB - Institute of Electrical and Electronics Engineers (IEEE)
CY - Piscataway, NJ
ER -