Reverse engineering of B-pillar with 3D optical scanning for manufacturing of non-uniform thickness part

Md Tasbirul Islam, A. B. Abdullah*, Mohamad Zihad Mahmud

*Corresponding author for this work

Research output: Contribution to journalConference paperpeer-review

13 Downloads (Pure)

Abstract

This paper presents reverse engineering (RE) of a complex automobile structural part, B-pillar. As a major part of the automobile body-in white (BiW), B-pillar has substantial opportunity for weight reduction by introducing variable thickness across its sections. To leverage such potential, an existing B-pillar was reverse engineered with a 3D optical scanner and computer aided design (CAD) application. First, digital data (i.e. in meshes) of exiting B-pillar was obtained by the scanner, and subsequently, this information was utilized in developing a complete 3D CAD model. CATIA V5 was used in the modeling where some of the essential work benches were "Digitized Shape Editor", "Quick Surface Reconstruction", "Wireframe and Surface Design", "Freestyle", "Generation Shape Design" and "Part design". In the final CAD design, five different thicknesses were incorporated successfully in order to get a B-pillar with non-uniform sections. This research opened opportunities for thickness optimization and mold tooling design in real time manufacturing.

Original languageEnglish
Article number01007
Pages (from-to)1-9
Number of pages9
JournalMATEC Web of Conferences
Volume90
DOIs
Publication statusPublished - 2017
Externally publishedYes

Bibliographical note

Copyright the Author(s). Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.

Fingerprint Dive into the research topics of 'Reverse engineering of B-pillar with 3D optical scanning for manufacturing of non-uniform thickness part'. Together they form a unique fingerprint.

Cite this