Soldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging

Alexandre Bessemoulin*, Melissa C. Rodriguez, Simon J. Mahon, Anthony E. Parker, Michael C. Heimlich

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

7 Citations (Scopus)

Abstract

Novel and realistic application of hot-via interconnects to millimeter-wave active and power MMICs is demonstrated for the first time. Power amplifier MMICs in the 80- and 100-GHz range were successfully designed, assembled, and characterized for wire-bond free chip interconnect technology. With hot-via RF transitions, compact E-band power amplifier MMICs directly soldered onto evaluation boards demonstrate 22-dB gain and over 28-dBm output power in the ETSI band of 81-86 GHz, with little performance degradation compared to reference circuits probed with traditional front-side RF pads. Similarly, a broadband amplifier, when interconnected to its matching PCB, delivers 13-dB of gain in the W-band, and 21-dBm P1dB. To the author's knowledge, this work represents the highest frequency demonstration of any soldered millimeter-wave hot-via active circuits onto standard PCBs, with remarkable measured power performance, closely equaling that of ideally front-side RF probed PA MMICs.

Original languageEnglish
Title of host publication2016 IEEE MTT-S International Microwave Symposium, IMS 2016
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1-4
Number of pages4
Volume2016-August
ISBN (Electronic)9781509006984
DOIs
Publication statusPublished - 9 Aug 2016
EventIEEE MTT-S International Microwave Symposium (IMS) - San Francisco, United States
Duration: 22 May 201627 May 2016

Publication series

NameIEEE MTT-S International Microwave Symposium
PublisherIEEE
ISSN (Print)0149-645X

Conference

ConferenceIEEE MTT-S International Microwave Symposium (IMS)
CountryUnited States
CitySan Francisco
Period22/05/1627/05/16

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