Soldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging

Alexandre Bessemoulin*, Melissa C. Rodriguez, Simon J. Mahon, Anthony E. Parker, Michael C. Heimlich

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

14 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science