The importance and challenges of comprehending circuit and physical phenomena in RF system design and integration

James Spoto*, George Chrisikos, Michael Heimlich, Steve Maas

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

8 Downloads (Pure)

Abstract

Cost, form factor, and time-to-market pressures are driving a relentless need to integrate and shrink wireless RF electronic systems and shorten their development cycles. New semiconductor and packaging technologies are available to facilitate this trend. However, progress in the application and deployment of these new technologies is hindered by disjoint and inadequate design methods and tools available today for RF product development. This paper addresses the challenges associated with RF system design and verification in the presence of detailed circuit-level impairments and physical implementation parasitics. Distortion, compression, noise, memory effects, as well as a number of other non-ideal effects, can dramatically degrade system performance. Many of these effects are difficult and expensive to extract and model at the system level. Once these RF systems are physically implemented, signals across the chip through the package and board are distorted and delayed by interconnect parasitics. In addition, disparate platforms for RF system, circuit, IC, and package/PCB design and verification limit the designer's ability to deal concurrently with these effects across these domains. Poor tool integration and the inability to take these effects into consideration early in the design cycle are responsible for a large number of expensive product development re-spins and delays. Solutions to some of these challenges are emerging and will be discussed. Other challenges are still only understood as proposed research topics, Ideas for their potential resolution will be presented herein as well.

Original languageEnglish
Title of host publicationICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings
EditorsTing-Ao Tang, Guo-Ping Ru, Yu-Long Jiang
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1825-1828
Number of pages4
ISBN (Print)1424401615, 9781424401611
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology - Shanghai, China
Duration: 23 Oct 200626 Oct 2006

Other

OtherICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology
CountryChina
CityShanghai
Period23/10/0626/10/06

Bibliographical note

Copyright 2006 IEEE. Reprinted from 2006 8th International Conference on Solid-State and Integrated Circuits Technology : proceedings : ICSICT-2006 : Oct. 23-26, 2006, Shanghai, China. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

Fingerprint Dive into the research topics of 'The importance and challenges of comprehending circuit and physical phenomena in RF system design and integration'. Together they form a unique fingerprint.

Cite this