Thermal performance of data centers-rack level analysis

Babak Fakhim; Nagarathinam Srinarayana; Masud Behnia; Steven W. Armfield

doi:10.1109/TCPMT.2013.2248195

Thermal performance of data centers-rack level analysis

Babak Fakhim, Nagarathinam Srinarayana, Masud Behnia, Steven W. Armfield

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Abstract

This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.

Original language	English
Article number	6482604
Pages (from-to)	792-799
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	3
Issue number	5
DOIs	https://doi.org/10.1109/TCPMT.2013.2248195
Publication status	Published - May 2013
Externally published	Yes

Keywords

cooling
data center
rack level analysis
thermal performance

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10.1109/TCPMT.2013.2248195

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@article{6d08cf4cc20148e99b8753b185a7dc25,

title = "Thermal performance of data centers-rack level analysis",

abstract = "This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.",

keywords = "cooling, data center, rack level analysis, thermal performance",

author = "Babak Fakhim and Nagarathinam Srinarayana and Masud Behnia and Armfield, {Steven W.}",

year = "2013",

month = may,

doi = "10.1109/TCPMT.2013.2248195",

language = "English",

volume = "3",

pages = "792--799",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

number = "5",

}

TY - JOUR

T1 - Thermal performance of data centers-rack level analysis

AU - Fakhim, Babak

AU - Srinarayana, Nagarathinam

AU - Behnia, Masud

AU - Armfield, Steven W.

PY - 2013/5

Y1 - 2013/5

N2 - This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.

AB - This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.

KW - cooling

KW - data center

KW - rack level analysis

KW - thermal performance

UR - http://www.scopus.com/inward/record.url?scp=84877578446&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2013.2248195

DO - 10.1109/TCPMT.2013.2248195

M3 - Article

AN - SCOPUS:84877578446

VL - 3

SP - 792

EP - 799

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 2156-3950

IS - 5

M1 - 6482604

ER -

Thermal performance of data centers-rack level analysis

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Keywords

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