Thin-film multi-chip-module prototype for millimeter-waves

O. Sevimli*, J. Wiggins, Val Dyadyuk

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

2 Citations (Scopus)

Abstract

We have developed a thin-film multi-chip-module process suitable for integrating millimeter-wave MMICs without the use of bond-wires or flip-chip bonds. In this paper, we present the performance of our prototypes incorporating commercial MMICs and show that the method is suitable for V-band operation. To the author's knowledge, this is the first time this approach was successfully demonstrated at V-band.

Original languageEnglish
Title of host publication2005 Asia-Pacific Microwave Conference proceedings, vols 1-5
EditorsW Hong, TJ Cui, D Fang
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages951-953
Number of pages3
Volume2
ISBN (Print)078039433X, 9780780394339
DOIs
Publication statusPublished - 2005
EventAPMC 2005: Asia-Pacific Microwave Conference 2005 - Suzhou, China
Duration: 4 Dec 20057 Dec 2005

Publication series

NameAsia Pacific Microwave Conference-Proceedings
PublisherIEEE

Other

OtherAPMC 2005: Asia-Pacific Microwave Conference 2005
CountryChina
CitySuzhou
Period4/12/057/12/05

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