Thin-film multi-chip-module prototype for millimeter-waves

O. Sevimli; J. Wiggins; Val Dyadyuk

doi:10.1109/APMC.2005.1606427

Thin-film multi-chip-module prototype for millimeter-waves

O. Sevimli^*, J. Wiggins, Val Dyadyuk

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

3 Citations (Scopus)

Abstract

We have developed a thin-film multi-chip-module process suitable for integrating millimeter-wave MMICs without the use of bond-wires or flip-chip bonds. In this paper, we present the performance of our prototypes incorporating commercial MMICs and show that the method is suitable for V-band operation. To the author's knowledge, this is the first time this approach was successfully demonstrated at V-band.

Original language	English
Title of host publication	2005 Asia-Pacific Microwave Conference proceedings, vols 1-5
Editors	W Hong, TJ Cui, D Fang
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	951-953
Number of pages	3
Volume	2
ISBN (Print)	078039433X, 9780780394339
DOIs	https://doi.org/10.1109/APMC.2005.1606427
Publication status	Published - 2005
Event	APMC 2005: Asia-Pacific Microwave Conference 2005 - Suzhou, China Duration: 4 Dec 2005 → 7 Dec 2005

Publication series

Name	Asia Pacific Microwave Conference-Proceedings
Publisher	IEEE

Other

Other	APMC 2005: Asia-Pacific Microwave Conference 2005
Country/Territory	China
City	Suzhou
Period	4/12/05 → 7/12/05

Access to Document

10.1109/APMC.2005.1606427

Cite this

Sevimli, O., Wiggins, J., & Dyadyuk, V. (2005). Thin-film multi-chip-module prototype for millimeter-waves. In W. Hong, TJ. Cui, & D. Fang (Eds.), 2005 Asia-Pacific Microwave Conference proceedings, vols 1-5 (Vol. 2, pp. 951-953). Article 1606427 (Asia Pacific Microwave Conference-Proceedings). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/APMC.2005.1606427

@inproceedings{3f2afd99bbda4eee982ad0e20bd4b40a,

title = "Thin-film multi-chip-module prototype for millimeter-waves",

abstract = "We have developed a thin-film multi-chip-module process suitable for integrating millimeter-wave MMICs without the use of bond-wires or flip-chip bonds. In this paper, we present the performance of our prototypes incorporating commercial MMICs and show that the method is suitable for V-band operation. To the author's knowledge, this is the first time this approach was successfully demonstrated at V-band.",

author = "O. Sevimli and J. Wiggins and Val Dyadyuk",

year = "2005",

doi = "10.1109/APMC.2005.1606427",

language = "English",

isbn = "078039433X",

volume = "2",

series = "Asia Pacific Microwave Conference-Proceedings",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

pages = "951--953",

editor = "W Hong and TJ Cui and D Fang",

booktitle = "2005 Asia-Pacific Microwave Conference proceedings, vols 1-5",

address = "United States",

note = "APMC 2005: Asia-Pacific Microwave Conference 2005 ; Conference date: 04-12-2005 Through 07-12-2005",

}

Sevimli, O, Wiggins, J & Dyadyuk, V 2005, Thin-film multi-chip-module prototype for millimeter-waves. in W Hong, TJ Cui & D Fang (eds), 2005 Asia-Pacific Microwave Conference proceedings, vols 1-5. vol. 2, 1606427, Asia Pacific Microwave Conference-Proceedings, Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, pp. 951-953, APMC 2005: Asia-Pacific Microwave Conference 2005, Suzhou, China, 4/12/05. https://doi.org/10.1109/APMC.2005.1606427

Thin-film multi-chip-module prototype for millimeter-waves. / Sevimli, O.; Wiggins, J.; Dyadyuk, Val.
2005 Asia-Pacific Microwave Conference proceedings, vols 1-5. ed. / W Hong; TJ Cui; D Fang. Vol. 2 Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), 2005. p. 951-953 1606427 (Asia Pacific Microwave Conference-Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

TY - GEN

T1 - Thin-film multi-chip-module prototype for millimeter-waves

AU - Sevimli, O.

AU - Wiggins, J.

AU - Dyadyuk, Val

PY - 2005

Y1 - 2005

N2 - We have developed a thin-film multi-chip-module process suitable for integrating millimeter-wave MMICs without the use of bond-wires or flip-chip bonds. In this paper, we present the performance of our prototypes incorporating commercial MMICs and show that the method is suitable for V-band operation. To the author's knowledge, this is the first time this approach was successfully demonstrated at V-band.

AB - We have developed a thin-film multi-chip-module process suitable for integrating millimeter-wave MMICs without the use of bond-wires or flip-chip bonds. In this paper, we present the performance of our prototypes incorporating commercial MMICs and show that the method is suitable for V-band operation. To the author's knowledge, this is the first time this approach was successfully demonstrated at V-band.

UR - http://www.scopus.com/inward/record.url?scp=33847208520&partnerID=8YFLogxK

U2 - 10.1109/APMC.2005.1606427

DO - 10.1109/APMC.2005.1606427

M3 - Conference proceeding contribution

AN - SCOPUS:33847208520

SN - 078039433X

SN - 9780780394339

VL - 2

T3 - Asia Pacific Microwave Conference-Proceedings

SP - 951

EP - 953

BT - 2005 Asia-Pacific Microwave Conference proceedings, vols 1-5

A2 - Hong, W

A2 - Cui, TJ

A2 - Fang, D

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, NJ

T2 - APMC 2005: Asia-Pacific Microwave Conference 2005

Y2 - 4 December 2005 through 7 December 2005

ER -

Sevimli O, Wiggins J, Dyadyuk V. Thin-film multi-chip-module prototype for millimeter-waves. In Hong W, Cui TJ, Fang D, editors, 2005 Asia-Pacific Microwave Conference proceedings, vols 1-5. Vol. 2. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). 2005. p. 951-953. 1606427. (Asia Pacific Microwave Conference-Proceedings). doi: 10.1109/APMC.2005.1606427

Thin-film multi-chip-module prototype for millimeter-waves

Abstract

Publication series

Other

Access to Document

Other files and links

Fingerprint

Cite this