Abstract
We have shown that Zr-based metallization can effectively remove hydrogen from the p-type GaN subsurface, which eventually leads to the formation of an ohmic contact. As the release of hydrogen starts at approx. 900°C, the thermal stability of the contact system is of particular importance. The remarkable thermal behavior of the ZrN/ZrB2 metallization is associated to the microstructure of each individual Zr-based compound, as well as to the interfacial crystalline accommodation.
Original language | English |
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Title of host publication | Materials Research Society Symposium - Proceedings |
Place of Publication | Cambridge |
Publisher | Cambridge University Press (CUP) |
Pages | W1091-W1096 |
Number of pages | 6 |
Volume | 595 |
Publication status | Published - 2000 |
Externally published | Yes |